This book has been written to provide newly arrived engineers in a silicon foundry environment with a comprehensive background in the fundamental physical and chemical basis for major front-end silicon treatments, such as oxidation, epitaxy, ion implantation and impurities diffusion, as well as giving a survey of the major types of equipment used in integrated circuit (IC) chip foundries.
Techniques include various forms of chemical vapor deposition (CVD), epitaxy, thin film technologies, lithography, masking, and other nanotechnologies.
As well as the target audience, the book will also be of great interest to engineers and advanced students in all these and related fields of electrical engineering, materials science, and manufacturing.
